Note: For this issue, Happy Holden provided a range of options for designers who are seeking to conserve materials in their next design. He also offered an example of the relative cost index, or RCI, that he developed at HP exclusively for PCB design. With this RCI, designers can figure out the relative cost of a new design compared to an eight-layer through-hole board.
Figure 1: Replacement chart for through-hole to HDI with Relative Cost Index. Note: RCI = the relative cost compared to an eight-layer through-hole board (RCI=1.0). DEN = total wiring in inches per square inch (diagonals of equivalent density).
Figure 2: VeCS (Vertical Conductive Structures) is a licensed technology using low-footprint vertical controlled impedance interconnect with low-leakage ground shielding capable of matching interconnect impedance with SE and differential microstrip and striplines. VeCS also provides high-density differential routing solutions in =/< 1.0 mm BGA area. Unique “anti-pad” layers provide a higher cross-section area for power and heat dissipation.
Figure 3: A variety of examples of landless vias on the outer layers of a PCB.
This article originally appeared in the August issue of Design007 Magazine, here.
Note: For this issue, Happy Holden provided a range of options for designers who are seeking to conserve materials in their next design. He also offered an example of the relative cost index, or RCI, that he developed at HP exclusively for PCB design. With this RCI, designers can figure out the relative cost of a new design compared to an eight-layer through-hole board.
Figure 1: Replacement chart for through-hole to HDI with Relative Cost Index. Note: RCI = the relative cost compared to an eight-layer through-hole board (RCI=1.0). DEN = total wiring in inches per square inch (diagonals of equivalent density).
Figure 2: VeCS (Vertical Conductive Structures) is a licensed technology using low-footprint vertical controlled impedance interconnect with low-leakage ground shielding capable of matching interconnect impedance with SE and differential microstrip and striplines. VeCS also provides high-density differential routing solutions in =/< 1.0 mm BGA area. Unique “anti-pad” layers provide a higher cross-section area for power and heat dissipation.
Figure 3: A variety of examples of landless vias on the outer layers of a PCB.
This article originally appeared in the August issue of Design007 Magazine, here.
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