| Our Capabilities |
| Item | Technical Specification |
| Standard | Advanced |
| Layer count | 1 - 12 Layers | 12 - 16 Layers |
| Base Material | FR4, Aluminum, High Tg, High CTI |
|
| Main Laminate Suppliers | Shengyi, KB, International, ITEQ, Laird Technologies (aluminium) |
|
| Finish Board Thickness | 0.20mm ~ 3.20mm | 0.13mm ~ 6.0mm |
| (8 mil ~ 126 mil) | (5 mil ~ 236 mil) |
| Minimum Core Thickness | 0.1mm(4 mil) | 0.08mm ( 3 mil) |
| Maximum Board Size | 500 x 600mm (19" x 23") | 1200 x 500mm (47" x 19") |
| Manufacturing Panel Size's | 16" x 20" and 18" x 24" |
| Copper Thickness | Min. 1/2oz, Max. 4oz | Min. 1/3oz, Max. 6oz |
| PTH Wall Thickness | 20um(0.8mil) min. | 25.4-38.1um(1-1.5mil) |
| Outer layer Min Track/Space | 1oz | 4mil (min) / 6mil (min) |
| 2oz | 6mil (min) / 8mil (min) |
| 3oz | 8mil (min) / 10.5mil (min) |
| 4oz | 10mil (min) / 14mil (min) |
| Inner layer Min Track/Space | 1oz | 4mil (min) / 4mil (min) |
| 2oz | 5mil (min) / 5mil (min) |
| 3oz | 6mil (min) / 6mil (min) |
| 4oz | 7mil (min) / 7mil (min) |
| Min. Hole Dia. | Drilling /PTH | φ0.2 mm ( 8 mil ) | φ0.10mm ( 4 mil) |
| Punching | φ1.0 mm ( 40 mil ) | φ0.90 mm ( 36 mil ) |
| Dimension Tolerance | Hole Position | ±0.076 ( 3 mil ) | ±0.05 ( 2 mil ) |
| Conductor Width(W) | ±20% Deviation of Master A/W | ±10% Deviation of Master A/W |
| Hole Dia.(H) | NPTH: ±0.05 mm ( 2 mil ) | NPTH: ±0.03 mm ( 1 mil ) |
| PTH: ±0.075 mm ( 3 mil ) | PTH: ±0.05 mm ( 2 mil ) |
| Outline Dim. | ±0.13 mm ( 5 mil ) | ±0.10 mm ( 4 mil ) |
| Surface Finish | Immersion Gold, Immersion Silver, Immersion Tin, HASL, LF HASL, OSP |
|
| Soldermask Bridge Width | 0.1mm(5mil) min. | 0.08mm(3mils) min. |
| V-CUT | Board Thickness | 0.50 mm (20mil) min. | 0.30 mm (12mil) min. |
| Remain Thickness | 1/3 board thickness | 0.40 +/-0.10mm ( 16+/-4 mil ) |
| Tolerance | ±0.13 mm(5mil) | ±0.1 mm(4mil) |
| Min. space - hole edge to trace | PTH hole: 0.20mm(8mil) | PTH hole: 0.13mm(5mil) |
| NPTH hole: 0.18mm(7mil) | NPTH hole: 0.10mm(4mil) |
| Aspect ratio | 8:1 | 10:1 |
| Thermal Shock | 3x10Sec@288 ºC | 3x10Sec@300 ºC |
| Warp and Twist | ≤0.75% | ≤0.5% |
| Electric Strength | >1.3KV/mm | |
| Peel Strength | >1.4N/mm | |
| Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | |
| Conductivity | <50Ω(typical:25Ω) | |
| Test voltage | 250V | |
| Impedance control | Character Impedance: 50±10%; Differential Impedance: 100±10%; |