Custom Printed Circuit Board PCB Assembly

Processing Technology: Electrolytic FoilBase Material: CopperInsulation Materials: Epoxy ResinCertification: UL, RoHS, ISO9001, Ts16949Transport Package: by Vacuum Packing in CartonsSpecification: UL, ROHS, SGSOrigin:ChinaHS Code: 85340090Min. Order: 100 PiecesPort: China Production Capacity:    100000 Square

Featured Products

Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Epoxy Resin
Certification: UL, RoHS, ISO9001, Ts16949
Transport Package: by Vacuum Packing in Cartons
Specification: UL, ROHS, SGS
HS Code: 85340090
Min. Order: 100 Pieces
Port: China 
Production Capacity:    100000 Square Meters Per Month
Payment Terms: L/C, T/T, D/P
Type: Rigid Circuit Board
Dielectric:    FR-4
Material: Fiberglass Epoxy
Application: Consumer Electronics
Flame Retardant Properties: V0
Mechanical Rigid: Rigid

Production Capacity:
Customized Printed Circuit Boards PCB Assembly

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