SMT is Surface Mount Technology (Surface-mount Technology) , which is the most popular Technology and process in electronic assembly industry.
SMT features:
1.With high assembling density, small volume and light weight of electronic products, the volume and weight of SMT components are only about 1/10 of those of traditional cartridge components. Generally, after adopting SMT, the volume and weight of electronic products are reduced by 40% ~ 60% and 60% ~ 80% respectively.
2.High reliability, strong anti-vibration ability, low defect rate of solder joint.
3.Good high-frequency characteristics, reduce electromagnetic and radio-frequency interference.
4.It is easy to realize automation and improve production efficiency. reduce costs by 30% ~ 50% . Save material, energy, equipment, manpower, time, etc.
SMT features:
1.With high assembling density, small volume and light weight of electronic products, the volume and weight of SMT components are only about 1/10 of those of traditional cartridge components. Generally, after adopting SMT, the volume and weight of electronic products are reduced by 40% ~ 60% and 60% ~ 80% respectively.
2.High reliability, strong anti-vibration ability, low defect rate of solder joint.
3.Good high-frequency characteristics, reduce electromagnetic and radio-frequency interference.
4.It is easy to realize automation and improve production efficiency. reduce costs by 30% ~ 50% . Save material, energy, equipment, manpower, time, etc.
Why use SMT:
1.The pursuit of miniaturization of electronic products, the previously used plug-in components have been unable to shrink.
2.Electronic products function more complete, the use of integrated circuit (IC) has no perforated components, especially large-scale, high-integrated IC, had to use surface chip components.
3.Mass production, production automation, the factory should be low-cost high-volume, high-quality products to meet customer demand and strengthen market competitiveness.
4.The development of electronic component, the development of integrated circuits (ICS) , and the diverse applications of List of semiconductor materials.
1.The pursuit of miniaturization of electronic products, the previously used plug-in components have been unable to shrink.
2.Electronic products function more complete, the use of integrated circuit (IC) has no perforated components, especially large-scale, high-integrated IC, had to use surface chip components.
3.Mass production, production automation, the factory should be low-cost high-volume, high-quality products to meet customer demand and strengthen market competitiveness.
4.The development of electronic component, the development of integrated circuits (ICS) , and the diverse applications of List of semiconductor materials.
Experienced Management Team
Continuous improvement and continuous of optimization of production processes.
Continuous improvement and continuous of optimization of production processes.
Customer service
Visit customers to provide SMT process experience for new product design.
Project discussion
Customers visit our company to discuss more project and plans.
Visit customers to provide SMT process experience for new product design.
Project discussion
Customers visit our company to discuss more project and plans.
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