Heat and moisture resistance Fr4 Ccl PCB substrate copper clad laminate

Heat And Moisture Resistance Fr4 Ccl Pcb Base Material Copper Clad Laminated SheetProducts InformationFR4 copper clad,use glass fiber cloth as substrate material, immersed with epoxy resin, bake into prepreg sheet, combined several prepreg sheets single side or double sides with copper foil, hot pressing, curing, then forming CC

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Heat And Moisture Resistance Fr4 Ccl Pcb Base Material Copper Clad Laminated Sheet
Products Information
FR4 copper clad,use glass fiber cloth as substrate material, immersed with epoxy resin, bake into prepreg sheet, combined several prepreg sheets single side or double sides with copper foil, hot pressing, curing, then forming CCL. 
ItemUnitValueTypical value
Copper foil peel streng125ºCN/mm≥0.71.5
Float288ºC/10sec ≥1.051.65
Thermal stress (float288ºC/unetched)sec≥10120
Warpage (without treatment)%≤1.00.20
Flammability -V-0V-0
Vitrification transition temperatureºC≥130138
Surface resistivity (35ºC air)≥1.0*1041.0*106
Volume resistivity(35ºC air)MΩ/cm≥1.0*1061.0*108
Dielectric constant(1MHz)-≤5.55.0
Dielectric loss factor (1MHz)-≤0.0350.024
Arc resistancesec≥60120
 
FR-4 copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with copper foil on one side or both sides, and CCL is finally formed by hot pressing and curing.

FR-4 copper clad laminated sheet has excellent thermal stability and machinability, widely used in the manufacture of printed circuit board (PCB) for television sets, computers, communications equipment and other electronic products.

It is a kind of copper foil covered laminated board formed through heat pressing after the electric industry alkali-free glass fiber dips into thermoset epoxy resins and is covered with copper foil at one side or both sides, called copper-clad laminate(CCL) .It is used for production of printed circuit board(PCB).
 
Material Fiberglass, epoxy resin
Sheet thickness 0.1-3.2mm
Color UV, Non-UV
Rated voltage 40KV
Tensile strength Excellent
Size 37" x 49", 41" x 49", 43" x 49" .
Copper thickness 12μm,15μm,18μm,25μm,28μm,35μm,70μm, as requested.
Features 1.TG: 135±5ºC(DSC).
 2.UV Blocking and AOI compatible.
 3.Good thermal resistance performance.
 4.Excellent dimensional stability.
 5.Excellent mechanical and electrical propertles.
Applications Computers, instruments, cameras, communication, equipment, electronic game   machine, televisions, etc.



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Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet
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Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet
Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet
Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet
Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet

Company Information

Xuchang Ruiyuan insulation material co.,ltd insist on the
idea " GOOD QULAITY, GOOD SERVICE ". it is establish 20years old.
It is located in Xuchang City, Henan Province, China. From 2010 year old our company begin deal international trade, based on the original business. Till now we import and export to many contries, such as United Kingdom, Germany, France, Ukrain, Bulgaria, Italy, India, Pakistan, Bangladesh, Korea, Brzil and so on.
 Our manufacturing technique is leading in this field and well known in the world. Now there are more than 20 product facilities, and 105 staff, including 5 senior technical, 20 intermediate technical. Main products are manufactured on international standard.
Our products mainly used for transformer and electrical motor, we produces insulation paper, insulation board, insulation tape,insulation film and also sales PTFE  FR4 PA6 and cable wire.
    We will develop with you by best-quality products, warm-hearted service and mutually beneficial cooperation!

Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet
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Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet
Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet

Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet
ServiceHeat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet
Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet


Heat and Moisture Resistance Fr4 Ccl PCB Base Material Copper Clad Laminated Sheet
 

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